Electronics Forum | Thu Jul 20 02:42:34 EDT 2006 | Francis
Short term, taped the gold finger. long term, study the air flow of the reflow section of the oven. It is always being overlook at this part and lookout for the printer. The air flow must be laminar and properly flowed back.
Electronics Forum | Tue Jul 18 10:16:49 EDT 2006 | russ
Clean up!, check all conveyors for paste, the printer, oven. If you are splattering in the oven than you need a better profile or better paste, one of the two, maybe both. Hope was helpful Russ
Electronics Forum | Tue Jul 18 11:49:24 EDT 2006 | slthomas
How does your profile fit the paste manufacturer's specs? It sounds like you could be ramping up a little fast and boiling your non-metal constituents.
Electronics Forum | Tue Jul 18 19:20:25 EDT 2006 | sharifudin
Actually we run lead free solder paste and the profile spec very tigh.I can't use capton tape due my product in panel form and save cost.I already verify conveyor,machine and tool free from dust and solder paste but the problem still remain.
Electronics Forum | Thu Jul 20 03:00:53 EDT 2006 | reypal
If you are using SMT machine for component placement you may check your nozzle where in some cases solder paste stuck to it and during placement will easily get into gold pad area. otherwise you have use kapton tape in order not to expose those pads.
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
