Electronics Forum | Tue Nov 01 14:50:05 EDT 2016 | dyoungquist
The bare pcb has lead HASL finish. Components are lead-free and lead-free solder was used to solder the plate-through components. Is this acceptable or will there be reliability issues?
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Thu Jan 06 17:33:07 EST 2011 | boardhouse
Hi Johan, Sounds like you have already gone over your product very well to reduce product cost. Switching away from Deep gold Tabs & carbon ink Key pads can save quite a bit. The only other thing to suggest would be material - Moving away from Isol
Electronics Forum | Wed Jul 29 22:50:17 EDT 1998 | Dave F
| We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone ha
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Fri Sep 21 14:45:36 EDT 2001 | jschake
I asked several people their opinion of HASL 0201 pads and there was no positive feedback whatsoever. The most common concern was the domed/convex shape of the pad finish that would result in aperture gasketing problems, which you may already have e
Electronics Forum | Thu Feb 22 16:40:23 EST 2007 | mika
One of our customers that always was going for Ni/Au surface finish on RoHS PCB and our processs was adjusted for that, "whithout any problem". Recently they decided to switch to another surface finsh: PbFree HASL. What is that? Imersion tin/silver?
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
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