Parts & Supplies | Other Equipment
Manual Component Lead Cut Bend QY-306B Specifications Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components FEATHERS 1. This lead fomring machine l
Parts & Supplies | Other Equipment
Manual Component Lead Cut Bend QY-306B Specifications Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components FEATHERS 1. This lead fomring machine l
Parts & Supplies | Other Equipment
Manual Component Lead Cut Bend QY-306B Specifications Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components FEATHERS 1. This lead fomring machine l
Parts & Supplies | Other Equipment
Manual Component Lead Cut Bend QY-306B Specifications Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components FEATHERS 1. This lead fomring machine l
Parts & Supplies | Other Equipment
Manual Component Lead Cut Bend QY-306B Specifications Lead Forming Machine Lead Former is used to lead cutting and forming of taped, bulk resistors, diodes,and other axial components FEATHERS 1. This lead fomring machine l
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
