New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Rework & Repair Equipment
This unique rework stenciling system is very simple to use. Adhesive Backed Stencil Thickness: 004in (.10mm), .005in (.13mm) and .006in (.15mm) Minimum Aperture Size: .002in (.05mm) Stencil Material: Plastic film with release liner. The adhesive bac
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Industry News | 2012-10-22 16:10:06.0
Multitest announces that its Mercury™ contactor with Q-tip successfully passed a two-month evaluation at a US-based IDM with test operations in Southeast Asia with excellent first-pass yield for more than 500k insertions.
Improve manufacturing operations and decision making based on real time shop-floor information Achieve goals for on-time delivery, eliminated waste, asset utilization, first pass yield, DPMO and total traceability. Valor IoT manufacturing collects
Universal Chip Programming with Precision Socket Actuator Lever. Precision High Volume Production Manual Programmer– the 2900L is a multisite manual production programmer ideal for volumes from 1K to 500K+ per year. BPM’s 2900L is excellent for small
Industry Directory | Manufacturer's Representative
FSP Group was established in 1993 and is now 5th largest power supply vendor worldwide. FSP Group USA provides all kinds of power supply products and services. Custom design models are welcome.
Valor MSS seamlessly integrates the entire PCB manufacturing process with one easy-to-manage platform. Available as an end-to-end suite, each of the following modules may also be installed separately. One platform supports your entire manufacturing
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
New Equipment | Test Equipment
The Agilent Medalist i1000 in-circuit test (ICT) system is a low-cost in-circuit test solution which now comes with digital testing capabilities while maintaining its original low-cost fixture solution. The Medalist i1000 in-circuit test (ICT) syst
