Industry News | 2011-06-29 16:16:19.0
Bliss Industries has created an entire new cart line called MoCart (Method of Operation Cart). The MoCart includes an entire line of patent pending accessories for all areas of the production factory and test labs, and is available in two cart heights: 40" or 50".
Industry News | 2017-01-24 11:29:45.0
Siborg Systems Inc. is hosting a mid-January sale on their popular LCR-Reader and Smart Tweezers multimeters and other SMD testing devices, starting January 18th, 2017 until the end of the month.
Industry News | 2009-04-08 20:01:36.0
MILPITAS, Calif. � March 2009 � Bliss Industries Inc., provider of handling carts and racks for electronics assembly, announces a new partnership with OnCore Manufacturing Services. OnCore, one of the world's premier electronics manufacturing companies serving the Defense, Medical and Industrial markets, recently purchased Bliss's FLEXconveyor, and has announced tentative plans to install the system into all of its facilities nationwide.
Used SMT Equipment | Pick and Place/Feeders
Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759
Electronics Forum | Wed Apr 03 12:34:52 EDT 2019 | franjov
Equip-Test main product lines are Test Probes, Test Fixture Kits, Customized ICT & Functional Test Fixtures, Integrated ICT with Function Test capabilities. If you are looking for some of these products just let us know we are global suppliers for th
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
Electronics Forum | Wed Mar 10 21:55:57 EST 2004 | Dreamsniper
Has anybody here could provide me good infos regarding BGA rework Kits other than the Flextac Stencil. Also on what sort of fixtures and toolings they provide to help me align the rework stencil onto the BGA pads. Thanks in advance... Hi to Dave F.
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Mon Aug 26 11:13:49 EDT 2002 | Marco Prince
There is a new tooling invention called the Instant Fixture System. It is a mechanical "cartridge" style dense pin-array system. There is a kit for MPM-UP 2000, and AP Series, and also for DEK-265 platforms. This instant fixture system offers very
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
