New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
WSM169 High voltage insulation grease Typical Applications : high voltage power supply, X-ray tube, high voltage cable connectors, high voltage electrical connectors, electrical connection components. SPECIFICATIONS: to prevent corona discharge an
Industry News | 2014-08-04 05:46:06.0
New tool features detailed data recording and analysis for optimized flash solutions
Industry News | 2007-12-03 21:58:15.0
HOUSTON � December 3, 2007 � BPM Microsystems announces that it has dramatically reduced the programming time for the NAND Flash Large Page Family from chipmaker STMicroelectronics. BPM�s newest flash memory programmer, the Flashstream, now programs nine times faster than its nearest competitor, up from six times faster when the product was introduced in April 2007.
Nokia E90 - 3,2 megapixel digital camera with auto focus and flash. High - speed 3G mobile broadband connections for Internet browsing and file. Talk on every continent with quad - band GSM global roaming. Access voice and data functions quickly and
Industry News | 2004-08-16 11:54:31.0
Low-cost CFII-IDE adapter provides panel-mountable solution for solid-state CompactFlash and IBM� Microdrive� media
Industry News | 2010-02-11 16:19:10.0
HOUSTON — February 10, 2010 — As the leader in flash memory programming technology, BPM Microsystems continues to outperform its competition by offering a guaranteed delivery date for new flash memory algorithm support in as fast as two business days and by offering a new reduced price annual support agreement option for the Flashstream® starting at MSRP $995.
Industry News | 2013-08-06 14:51:14.0
Data I/O Corporation (NASDAQ: DAIO) today announced Anthony Ambrose, President and CEO, will present at the upcoming Flash Memory Summit on best practices for programming Multi Level Cell (MLC) NAND memory devices.
Industry News | 2017-11-01 15:15:49.0
Data I/O Corporation will demonstrate UFS device programming for automotive applications on the LumenX™ programming platform at the international productronica trade show November 14th – 17th in Munich, Germany at Hall A2, Booth 205.
Industry News | 2016-03-31 03:00:48.0
The fully integrated MTCS-CDCAF sensor chip solution: Guarantees defined light
