Industry Directory | Manufacturer / Distributor
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Industry Directory | Manufacturer
Supplier of High-Tech Low-Cost Printed Circuit Boards with 1-48 layers from 24h express. Flex, flex-rigid, metal core, impedance control, blind & buried vias as well as SMD Stencils.
New Equipment | Education/Training
Designing Flex and Rigid-Flex Applications Duration: 90 minutes Abstract: Of course they bend and can be formed, but did you know that flexible circuit boards are lighter weight, more durable and more cost effective than a rigid board or wiring
Electronics Forum | Tue Mar 21 19:34:32 EST 2006 | Tom Smykowski
Omar: I dealt with this so called "hot bar" process also, and you're right; it's neither reliable nor repeatable. The goal was to attach a flex LCD display to another flex circuit. The flex LCD was constructed of resin and conductive silver particl
Electronics Forum | Sat Feb 02 09:48:27 EST 2002 | davef
We've talked about assembling on flex previously. Search the fine SMTnet Archives for background. Issues that come to mind [which is very risky, given that this Saturday morning and last night was at Jimbo's] are: * Use carriers that can flow thoug
Used SMT Equipment | In-Circuit Testers
Agilent/HP 85132F Flexible Cable Set The Agilent 85132F is a 62.9 cm (24.75 in) long flexible cable set composed of two 3.5 mm female to 7 mm connectors. Cable frequency range is dc to 18 GHz with a return loss greater than or equal to 17 dB. Inser
Used SMT Equipment | In-Circuit Testers
Agilent 85132F Agilent/HP 85132F Flexible Cable Set, 3.5 mm (Test Port) to 7 mm The Agilent 85132F is a 62.9 cm (24.75 in) long flexible cable set composed of two 3.5 mm female to 7 mm connectors. Cable frequency range is dc to 18 GHz with a re
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains SMTnet Express January 9, 2013, Subscribers: 26086, Members: Companies: 9075, Users: 34138 The Application of Spherical Bend Testing to Predict Safe
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/materials
. Testing back-thinned ceramics like silicon die poses unique challenges that can be overcome with DAGE Bond testers. 3-4 Point Bend Flexural Testing App Note As well as offering micro flex testing, DAGE bond testers can carry out bending of full circuit boards according to industry standards such as ASTM D790
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
114 Barrington Town Square
Aurora, OH USA
Phone: 13309956900
