Electronics Forum | Wed Aug 09 04:20:19 EDT 2006 | Rob
If you kink the leads will you be able to insert it without flexing the board/moving any of the other components? Also these pin headers aren't always designed for this process so have you checked that it will take the elevated temperatures?
Electronics Forum | Wed Aug 09 10:31:10 EDT 2006 | PR
pin and paste works. don't use gel flex at screen printer. Good luck PR
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Wed Jun 13 21:33:34 EDT 2001 | davef
Todays crazy idea?! (environmental safe) February 22, 2001 05:33 AM Mattias Andersson [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&Message_ID=5343&_#Message5343] Turning things just a bit, our working theory is: burnt flux
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Thu Jul 10 08:48:06 EDT 2003 | Kris
Hi, What would you consider significantly different about lead-free on flex circuits than tin-lead of flex circuits ? Have you published your experiances that you encountered while changing over to lead-free solder paste from a tin-lead paste ? T
Electronics Forum | Fri Feb 25 15:08:30 EST 2005 | jdengler
John, We tape (usually high temp tape) flex to a fixture (usually 0.090" piece of bare FR4). We make an outline on the fixture to get a rough location then use fiducials on the flex for alignment. Print, place, reflow, cool, remove flex. When the
Electronics Forum | Thu May 01 15:22:39 EDT 2003 | Chris
Are there any guidelines when building products with flex circuits? Any heat profile guidelines? Wash Guidelines? Handling Guidelines. Is it best to run on the same line?
Electronics Forum | Wed Jul 16 00:15:38 EDT 2003 | iman
just out of curiousity, why the special nitrogen cabinet concerns for gold plated flex PCB? common "myth/fact" is gold is an "inert" coating layer that is not going to react with room environment conditions *that much?*. Am learning here, so would ap
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