Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Thu Jul 14 17:18:38 EDT 2005 | August
Dear All, I'm looking for the complete SMT equiment line (solder printer, P&P, Reflow) uses for the small volume production line. I happen to know that Manncorp and APSGold can provide the complete ST line, but I haven't hear and use these machine be
Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach
| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee
Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari
Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
Electronics Forum | Mon Oct 05 11:51:55 EDT 2009 | mikesewell
We managed to run a ~30" board on an Assembleon Topaz/Emerald with only an 18" capacity by getting creative with the board sensors/clamping and running it as two programs, the manufacturer actually helped us through the workaround. I think we hand
Electronics Forum | Fri Jul 02 09:27:36 EDT 2010 | remullis
I am new to flex circuit manufacturing, placing SMT. We have a need to use this technology, but I have no experience in the process. The sample our design engineers have obtained are from a company called Allflex. How does this process work? printi
Electronics Forum | Fri Oct 07 17:22:16 EDT 2011 | davef
Questions are: * Pressure? * Heating ramp? * Solder alloy? * Solder preform or paste reflow? [We have more, depending on your answer] * 0.5 mm is pretty tight. Talk about tooling holes and measures to prevent flexing of the assembly * In time, heat a
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
