Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
SMT, Pick and Place, Universal Instruments, Juki, Panasonic Factory Automation, Chipshooter, Lightning head, PCB, Reflow Oven, Model GC30s
New Equipment | Board Handling - Pallets,Carriers,Fixtures
The low cost surface mount carrier used to hold PCB’s in place without tooling pins. The composite fixture is engineered to use flexible tabs that press the edges of the PCB into an accurate location. With downward pressure and nothing above the P
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
Used SMT Equipment | Pick and Place/Feeders
Universal Genesis GSXB033 Multifunction Placement Machine w/ 7 Spindle Inline & 4-spindle Flex Heads AUCTION ITEM: www.xlineassets.com Auction Starts Soon! Complete Closure of Late Model SMT and Thur Hole Facility Over 500 items to be sold inc
We are electronic contract manufacture and we also have JIT facility. Our head office located in Markham, Ontario, Canada. We do have a facility in USA, MEXICO and BRAZIL.
Used SMT Equipment | Soldering - Reflow
(2) Vitronics XPM2 Reflow Ovens - Auction Items www.xlineassets.com - Auction September 10th Other Available Equipment in Same Auction: • Fuji CP65 Chipshooter, SN 793, 0201 Camera Fuji • QP 351-MM Pick and Place System • Fuji QP 351-MM Pick
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
EMC Global Technologies At EMC Global Technologies we manufacture fixtures and tooling for the processing of printed circuit board assemblies. FIXTURES Wave Solder Pallets Dedicated or Adjustabl
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
