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Koh Young ZENITH Alpha 3D AOI

Koh Young ZENITH Alpha 3D AOI

New Equipment | Test Equipment

Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z

Qersa Technology Co.,ltd

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

good news for LED industry

Industry News | 2018-10-18 09:26:46.0

good news for LED industry

Flason Electronic Co.,limited

Top 10 Consumer Electronics Companies in the World

Industry News | 2018-12-08 03:35:10.0

Top 10 Consumer Electronics Companies in the World

Flason Electronic Co.,limited

Tektronix Y350C-YBT250-AR1-IN1

Tektronix Y350C-YBT250-AR1-IN1

Used SMT Equipment | In-Circuit Testers

Tektronix Y350C-YBT250-AR1-IN1 The NetTek OTDR simplifies installation and maintenance testing of fiber optic cabling. The NetTek OTDR provides a total fiberoptic I&M test package, combining the NetTek platform with OTDR and power meter modules t

Test Equipment Connection

Tektronix Y350C-YBT250-AR1-IN1

Tektronix Y350C-YBT250-AR1-IN1

Used SMT Equipment | General Purpose Test & Measurement

Tektronix Y350C-YBT250-AR1-IN1 The NetTek OTDR simplifies installation and maintenance testing of fiber optic cabling. The NetTek OTDR provides a total fiberoptic I&M test package, combining the NetTek platform with OTDR and power meter modules t

Test Equipment Connection

Cad/Laser Tech

Career Center | Lumberton, USA | Engineering,Production

Metal Etching Technology Inc. is one of the United States leading Manufacturers of solder paste stencils for the electronics industry. Candidate's responsibilities will include printing and manipulating cad data, transferring files via internet/em

MET Stencil

BPM Introduces BPWin Version 5.0

Industry News | 2009-06-26 17:15:18.0

HOUSTON — June 2009 — BPM introduces BPWin 5.0, a culmination of new and recent improvements in efficiency, productivity, intellectual property protection and process management.

BPM Microsystems, Inc.

Customer Engineer

Career Center | Dallas, Texas USA | Engineering

Responsibilities: Researches and understands the customers' requirements for the product function. Responsible for departmental communication and resolution to all the customers technical issues. Responsible for communicating yields and improvement

EMSR, Inc.

SPI 50T - 3D Solder Paste Inspection System

SPI 50T - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde

PARMI


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