Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Training Provider / Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Yamaha YSM10 Pick and Place High-Speed Modular SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT Pick and Place Machine, Yamaha Chip mounter, for SMT assembly system. Applicable PCB L 510 x W 460mm - L 50 x W
Used SMT Equipment | Pick and Place/Feeders
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YAMAHA YS24 Ultra-High Speed Module SMT Machine Model: YS24X Object substrate: L50 * W460mm W50mm ~ L700 SMT capacity: (best conditions) 54000 CPH (0.067 seconds/CHIP) SMT precision: when the company evaluation by using standa
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-03-28 08:24:43.0
The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Nov 30 18:30:00 UTC 2021 - Tue Nov 30 18:30:00 UTC 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Events Calendar | Tue May 03 18:30:00 UTC 2022 - Tue May 03 18:30:00 UTC 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | Gent, Belgium Belgium | Engineering,Production,Quality Control,Research and Development
PCB fabrication, IC packaging, SMT assembly, flip-chip assembly, reliability evaluation
Career Center | , | 2001-03-19 10:07:06.0
Experience as service engineer of Universal Insturnments Corp. Knowledge in surface mount, auto insertion, and advanced packaging (flip chip). Knowledge in pcb assembly.
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/00337450s03-asm-flip-chip-camera-211723?page=74&order=name+asc
SIEMENS ASM Flip Chip Camera 00337450S03 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products ASM Flip Chip Camera Public Pricelist Public Pricelist ASM
| https://www.smtfactory.com/What-is-an-LED-Flip-Chip-id3680601.html
What is an LED Flip Chip? - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español Français Hrvatski Italiano magyar Nederlands Polski Português Pусский românesc Slovenščina Suomalainen Türk dili Tiếng Việt العربية فارسی עִברִית 한국어 日本語
