Global solutions for Electronics Manufacturing Services. 5 facilities featuring 17 Fuji & 16 Quad SMT lines, BGA & Micro BGA (Rework/2D X-ray), PTH, Flip Chip, COB, Prototype, ATE (Incircuit & Functional), Box Build, Fulfillment, DFM/DFT and Design.
Provider of PCB Design, Fabrication, Assembly and Test Services. Burn-in Boards, Environmental Testing, BGA Rework & Xray services including Chio-On-Board and Flip Chip Assembly.
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
New Equipment | Solder Materials
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping a
New Equipment | Rework & Repair Equipment
BGA-936UA : Eficiente, Confiável, Fácil de Usar Em ambientes de produção, manutenção e de pesquisa Com processos empregando solda convencional ou Lead Free Retrabalhando componentes BGA, micro BGA, CSP, Flip Chip, QFP, SOP, PLCC entre outros; E
Industry Directory | Manufacturer
CASE is a full service electronics contract manufacturer specializing in multi layer double sided surface mount, micro BGA's, flip chip, csp, and the highest of technology. A company built on customer service. New Englands most well equipped facility
Automated Assembly Corporation is a Contract Mfg. specializing in SMT-Flexible Circuits. Roll-to-Roll Assembly on Polyester, Polyimid, & PEN films. From Flip Chip on Polyester, to BGA. 24 Hr. Prototype, Low, Medium, High Volume. ISO-9001 Certified
Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.
Turn-key xray systems for BGA, FlipChip and solder analysis
Flux in-line Solder Flux Inspection and Measurement System process control tool for BGA, CSP and flip chip component manufacturing
