A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.
REI Company is a contract manufacturing company. We are in this business for the past 14 years. We assemble right from through hole to flipchip components. We handle prototypes as well as high volume productions.
Turn-key xray systems for BGA, FlipChip and solder analysis
For Solder Jet Bonding – SJB / Flip-Chip
Electronics Forum | Fri Jun 18 04:15:27 EDT 1999 | Frank
I would like to carry out a survey of all the available flipchip bump metallurgies available with the compatible bond pad finishes and compatible substrate attachment methods. The results will be posted on this forum. Your input will be very much app
Electronics Forum | Thu May 31 15:04:49 EDT 2001 | flipchip
Check out APE's web site. http://www.apecorp.com There is also a repair video at http://members.nbci.com/smtrework/chipmaster.ram showing cans being removed. If you have any questions or want to see a demo in house, give us a call. 305-451-4722
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Industry News | 2003-03-28 08:24:43.0
The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Pick and Place/Feeders
Flipchip Camera SIPLACE SX4
Parts & Supplies | Pick and Place/Feeders
Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 18.500 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Cabuyao,, Laguna Philippines | Engineering,Maintenance,Production,Technical Support
�X 10 years experience in SMT field of manufacturing company,knowledge in GC-Powerplace software. �X Knowledge in programming and operating Modular/Turret Machine in Surface Mount Technology and Flipchip technology. �X Expertise in the field of SMT m
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
Surface Mount Technology Association (SMTA) | https://www.smta.org/LED/tech.cfm
:30 PM Solder Flux Cleaning, Reliability, and Optical Performance of UV Flipchip LEDs Nicholas Herrick, Alpha Assembly Solutions 2
| https://www.smtfactory.com/Regarding-the-adjustment-methods-and-development-trends-of-Semi-auto-SMT-Production-Line-id49852477.html
mobile phones, which further drives the Semi-auto SMT Production Line surface mount The miniaturization of components and the high-density of product assembly, 0201 components, CSP, flipchip and other small and fine-pitch devices have also
