Used SMT Equipment | Repair/Rework
Hakko 485-V12 Soldering Station is a compact soldering system designed for soldering and de-soldering components and connectors on PC boards. Unit includes full pot of SAC 305 No Lead Solder. Solder flow is time-controlled and temperature-controll
Used SMT Equipment | Soldering - Wave
Used, reconditioned, resurfaced and melonite coated for Pb Free wave solder process. Speedline , Electrovert, Lambda Wave, Ultra fill 22" nozzle and flow duct. Excellant condition. Complete and operational. FOB: Origin MN 55439
Technical Library | 2008-08-28 22:50:11.0
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.
Used SMT Equipment | Soldering - Reflow
2007 ERSA HotFlow 2/20 Reflow Oven Working Width 2"-20" Process Length 191" Heating Zone 143" Cooling Zone 48" Infeed Zone 28" Outfeed Zone 28" Kyle@LELsemi.com
Solder-Saver offers companies 'wave soldering' the opportunity to rapidly recycle dross created in the wave solder pot, thereby saving up to 50% in new solder bar purchases.
Industry Directory | Distributor / Manufacturer
PROMATION offers automated solution in many key SMT and Backend Assembly areas: PCB handling systems, robotic soldering systems, laser marking, collaborative robots, AMRs and fleet mapping, and work bench/work flow solutions.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
New Equipment | Solder Materials
The Solder-Saver, from Aprotec: offers the opportunity to instantly recyle dross created in the solder pot. Hot dross is scooped up from the surface of the wave solder pot by the hand held, lightweight Solder-Saver. The unit separates dross oxides
Used SMT Equipment | Soldering - Reflow
Heller 1809 MKIII (9 Zones) MFG 2009 Around 30 ~32 K hours Mesh belt No center support Edge rail PCB Transfer option Right-to-Left PCB flow Power 480 Volts
Used SMT Equipment | Soldering - Wave
Seho wave solder, model 1235 F N2, 208VAC, L to R board flow, V finger Was last using Pb solder, well maintained, complete and operational. FOB: Origin Contact AssuredTechnicalServiceLLC@Gmail.com for addtional information
