Career Center | South West, Texas USA | Engineering,Management,Production
DESCRIPTION Growing and financially secure international manufacturing company is looking for a process or industrial engineer who is committed to developing and implementing lean practices, cell manufacturing, kanbans, and being a world class manuf
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Industry Directory | Manufacturer
SMT is a supplier of thermal processing equipment including forced convection reflow soldering and curing systems.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our Wave Solder Fixtures increase productivity and eliminate defects in your pcb assembly process. This type of fixture supports the pcb on all four sides eliminating warpage that can cause solder skips and bridges or pcb flooding. They also elim
Used SMT Equipment | Soldering - Reflow
2011 Vitronics XPM3i Solder Paste Reflow Oven in good working condition. R to L Board Flow, Edge Rail. Additonal Vitronics and BTU Reflow Ovens in stock. FOB: Origin Contact Assured Technical Service LLC for details
Used SMT Equipment | Screen Printers
2011 Speedline Technologies Accela Solder Paste Screen Printer, L to R Board Flow, Complete and Fully Functional. FOB: Origin MN USA Additional Solder Paste Screen Printer in stock, please inqure. Contact: AssuredTechnicalServiceLLC@Gmail.com for add
Used SMT Equipment | Soldering - Reflow
2011 Vitronics XPM3i 1030 Solder paste reflow oven, R to L Board Flow, Edge Rail only. FOB: Origin Contact Assured Technical Service LLC AssuredTechnicalServiceLLC@Gmail.com
Used SMT Equipment | Soldering - Reflow
Becoming available soon, 2011 Vitronics XPM3i 1030 Solder Paste Reflow Oven, L to R Board Flow, Pin chain and Mesh Belt, Winodws O/S FOB: Origin Contact Assured Technical Service LLC
Used SMT Equipment | Soldering - Wave
2006 TD Wave Solder Machine, 240VAC Single phase, L to R board flow, last running 63/37, available as Pb Free - RFQ FOB: Origin Contact: AssuredTechnicalServiceLLC@Gmail.com
