Industry News | 2015-04-07 17:14:44.0
KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.
New Equipment | Solder Materials
FCT Assembly Fluxes are designed to be used with both SN100c and SAC305 alloys. By combining our latest flux tecnologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. FCT Assembly Flux Comparisons:
MAS-i2 Selective Soldering Machine is formed by 3 processes as blow and all the processes are integrated into one compact machine. ● Selective spray flux part: #11;It can do selectively flux spraying to required position on PCB. ● Preheating part:
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
New Equipment | Solder Materials
Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a
Industry Directory | Manufacturer
UK manufacturer for solder pastes, bar solder, cored solder wires, fluxes and cleaning products
Used SMT Equipment | Soldering - Wave
Solder type lead free solder Max PCB 50—250mm Components height Above ?130mm under ?8mm Pot Capacity 130KG ( Titanium / SUS316 ) Preheating length
