The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transf
Industry News | 2016-04-22 10:20:35.0
Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.
New Equipment | Assembly Services
S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp3.5™ and KappZapp4™ Silver solders to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 350°F - 500°F (176°C - 260°C). Learn m
Used SMT Equipment | Soldering - Reflow
Desk Reflow Oven Features: Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200 is a fine temperature profile model wit
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Industry Directory | Consultant / Service Provider
Subcontract electronic, mechanical, optical, embedded software design & development
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
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