NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
Electronics Forum | Mon Feb 18 17:36:32 EST 2008 | kennyg
I should have mentioned... the only flux we use for the hand soldering is wire-core, no bottle flux. I think it should be a non-issue to leave the activated wire core flux residue. I'm just looking for some way to prove it to the designer.
Electronics Forum | Mon Feb 18 17:27:13 EST 2008 | jdumont
If the hand soldering is done right and you use little to no extra flux (other than whats in the solder wire) you should be ok. You should still verify with some testing however... You need to make sure any flux used is activated, thus rendered benig
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Technical Library | 2017-07-20 15:18:15.0
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. FLUX COMPARISON Low Activity Medium Activity High Activity Flux Comparison chart shows relative activity ranges of each flux category
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
