New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
New Equipment | Cleaning Agents
KYZEN E5321-LF is a room temperature pallet and maintenance cleaning agent specifically designed to remove flux residues from wave solder pallets, reflow oven filters, spray nozzles, air bubbling diffusion bars, and other assembly hardware used to so
New Equipment | Cleaning Agents
AQUANOX A4638 is an engineered cleaning solution designed to remove flux residue from flip-chip and low clearance components on electronic assemblies and advanced packages. Due to low surface tension, AQUANOX A4638 removes water-soluble polar flux re
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
New Equipment | Cleaning Agents
KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an
Heller 1936 MKV Reflow Oven Reflow Oven SMT Reflow Oven Heller 1936 MKV Reflow Oven Heller 1936 MKV Product description: Heller 1936 MKV Reflow Oven Heller 1936 MKV Reflow Oven Products description Flux Free Formic Reflow REFLOW IN FORM
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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI GAS SPRING B RH06 6Z51 40118515 Original new Supply all juki spare parts at low price JUKI ESR14048000 FLUX COLLECTION MAT 450N FUJINTAI TECHNOLOGY CO.,LTD JUKI ESR14048100 BUZZER STOP SWITCH PBS14 www.fujintai.com JUKI ESR14049
New Equipment | Cleaning Agents
AQUANOX® A4625 is a versatile aqueous cleaning chemistry designed to clean the latest lead-free residues while providing brilliant mirrored solder finishes. Easy to use, AQUANOX® A4625 is environmentally friendly, has a long tank life and is safe fo
New Equipment | Cleaning Agents
Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX® A4638 is designed to remove water s
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
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