Parts & Supplies | Soldering - Wave
Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji
Industry News | 2024-01-29 11:14:41.0
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.
Precision Cleaning Medium For Manual Flux Removal VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast a
New Equipment | Solder Materials
Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
New Equipment | Assembly Services
S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar
Industry News | 2010-03-30 14:09:38.0
OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2010-02-08 12:11:13.0
OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
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