Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Industry News | 2017-01-30 19:56:21.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present two papers at the upcoming IPC APEX EXPO at the San Diego Convention Center. “Electrochemical Methods to Measure the Corrosion Potential of Flux Residues” will be presented during Session S04 on Tuesday, Feb. 14, 2017 from 1:30-3 p.m. The paper was co-authored by David Lober and Anna Ailworth, KYZEN, and Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean and Kyle Loomis from Kester Corporation. The paper entitled, “Does Cleaning the PCB before Conformal Coating Add Value?” will be presented during Session S20 on Wednesday, Feb. 15, 2017 from 1:30-3 p.m. The paper was co-authored by Mark McMeen and Jason Tynes, STI Electronics, and Gustavo Arredondo, ParaTech Coating.
Industry News | 2009-07-16 14:35:03.0
POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.
Industry News | 2013-04-08 13:55:00.0
Sono-Tek Corporation (OTC BB: SOTK) 2012 saw significant growth worldwide for Sono-Tek’s fluxing line for wave solder process.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Industry News | 2011-05-06 21:39:30.0
Kyzen announces that Phil Zhang, its China Sales Manager, will present twice during the upcoming SMTA China East conference, which is being held in conjunction with NEPCON China 2011.
Industry News | 2017-08-29 15:45:56.0
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
