Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
New Equipment | Cleaning Agents
AQUANOX A4638 is an engineered cleaning solution designed to remove flux residue from flip-chip and low clearance components on electronic assemblies and advanced packages. Due to low surface tension, AQUANOX A4638 removes water-soluble polar flux re
New Equipment | Cleaning Agents
CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wave solder fingers, reflow oven surfaces and general electronics production equipment. C8502 is also effective on rosin flux used on fabrication of dissimilar
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
Industry News | 2015-01-21 20:14:04.0
Sono-Tek Corporation (OTC BB: SOTK) will highlight the newest improvement to the SonoFlux ultrasonic spray fluxer design, the QR Impact Jet in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The Impact atomizing assembly is used in both the Sono-Flux Servo and Sono-Flux EZ system and incorporates an air deflector that drives the flux droplets to the PCB for maximum top side fill and unsurpassed through-hole penetration.
Industry News | 2015-10-21 19:45:39.0
Sono-Tek Corporation (OTC BB: SOTK) will highlight the QR Impact Jet on the SonoFlux ultrasonic spray fluxer in Hall A4, Booth 141 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. The Impact atomizing assembly is used in both the SonoFlux Servo and SonoFlux EZ system and incorporates an air deflector that drives the flux droplets to the PCB for maximum top side fill and unsurpassed through-hole penetration.
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New Equipment | Wave Soldering
This machine use hot air and infrared mix heating system which can increase the speed and the uniformity of heating. It has lofs of advantage such as flux saving, quick response, easy coding and easy operation. Use a nitrogen devi
Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
