New Equipment | Wave Soldering
China Wave Soldering Machine Manufacturer KTU-350 Preheating zone 4 zones Solder pot capacity Approx.480kg Weight Approx.1500kg Dimension 4500*1600*1730mm Product description: China Wave Soldering Machine Manufacturer KTU-350, China biggest 1st
New Equipment | Wave Soldering
DIP Automatic Wave Soldering Machine KTU-350 Preheating zone 4 zones Solder pot capacity Approx.480kg Weight Approx.1500kg Dimension 4500*1600*1730mm Product description: DIP Automatic Wave Soldering Machine KTU-350, Automatic heating, solderin
New Equipment | Wave Soldering
SMT Reflow Oven Preheating zone 4 zones Solder pot capacity Approx.480kg Weight Approx.1500kg Dimension 4500*1600*1730mm Product description: China Wave Soldering Machine KTU-350 Manufacturer, Preheating zone 4 zones, Solder pot capacity App
New Equipment | Cleaning Equipment
Maximize your stencil cleaning results! AKS Stencil Cleaner provides microscopic, ultrasonic removal of solder paste and post-solder flux buildup. All-in-one cleaning All “workstations” included in one compact unit, minimizing required floorspace.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Industry News | 2023-07-19 09:24:50.0
SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
China Durostone CHP760 for PCB Solder Pallets Overview: 1, China Durostone CHP760 is made from blue composite material and reinforced fiberglass. 2, CHP760 is the blue standard one which is not antistatic. 3, The product uses a high performanc
Industry News | 2013-09-09 16:09:16.0
Kyzen announces that Debbie Carboni will present at the upcoming Cleaning and Reliability workshop, together with Aqueous Technologies, FCT Assembly,
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
