New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
Electronics Forum | Fri Apr 22 05:01:19 EDT 2011 | azrina
Hi, I am doing my master degree in flux cleaning process for flip chip assemblies and required to establish a new receipt for flux cleaning. currently, i am doing screening process for the parameters involve ; temp,pressure, surfactants, speed and a
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
are ideal for wafer-level and 3D packaging applications. Bumping Semiconductor wafer bumps and copper pillars are an important interconnect technology which enable devices such as flip chips to be fabricated
