704 flux excess results

Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB

Fix Trade BV

Understanding Creep Corrosion Field Fails

Technical Library | 2022-03-16 19:48:18.0

Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction

Foresite Inc.

KYZEN® Defoamer - Aqueous Based De-foaming Agent for Electronics Assembly Cleaning

New Equipment | Cleaning Agents

KYZEN® Defoamer is an effective de-foaming agent to eliminate foam build-up in aqueous in-line cleaners. KYZEN Defoamer has been found to be especially effective for use in captured wash tanks where water soluble flux residues cause excessive foaming

KYZEN Corporation

AMTECH

Industry Directory | Manufacturer

Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.

Saki Saki 3D SPI machine

Parts & Supplies | Soldering Equipment/Fluxes

3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea

Goodluck Electronic Equipment Co.,Ltd