New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Rework & Repair Equipment
The PDR E3S SMD Rework Station offers dual closed loop feedback for advanced BGA Repair, QFN Repair, Flip Chip Repair, DFN repair, QFP's, SOIC's and more, and is is engineered with only the finest materials and components for optimum precision and r
Electronics Forum | Thu Jul 14 04:28:45 EDT 2005 | lloyd
Folks, Thanks for all the info and suggestions but let me add a bit more to the pot. Our products work in a harsh environment and are classed as safety critical. Customer returns are our biggest concern, we don't get very many and feeling here seem
Electronics Forum | Tue Apr 27 15:57:44 EDT 2004 | Don Ackerman
We are a capacitor manufacturer. After crimping, we inspect the case length with digital calipers. The harsh environment (acid) destroys the calipers. Has anyone found chemical resistant measuring devices that will withstand this hostile environment?
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Fri Mar 27 00:00:00 EDT 2020 - Fri Mar 27 00:00:00 EDT 2020 | ,
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t&page=32
. Products Content Your results for: Solder Paste and Flux PICO® Toµch™ Controllers Nordson EFD The PICO Toµch controller’s intuitive touchscreen interface greatly simplifies setup and operation of the PICO Pµlse
FKN Systek | http://fknsystek.com/Step%20Motors.htm
Hot List for Step Motors Step Motors and Controllers from Stogra Rugged Stepper Motors for Harsh Environments Nema sizes 23, 34, and 42 Step accuracy ±3% based on a 1.8
