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DJAW-10 Stencil Cleaner

DJAW-10 Stencil Cleaner

New Equipment | Cleaning Agents

DJAW-10 is a long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes. DJAW-10 is formulated for application by hand or automated dispensing equipment. Unlike other stencil cleaners,

AIM Solder

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Kolb PSE 300 2HD

New Equipment | Cleaning Equipment

Cleans screens, stencils, coating carriers, solder carriers, misprints Economy cleaning system for screens, stencils, PumPrint stencils The kolb PSE economy line is a quality series of advanced cleaning systems, which focuses on all essen

A-Tek Systems Group LLC

Lead Free Wave Solder Machine S400

Lead Free Wave Solder Machine S400

New Equipment | Wave Soldering

Quick Overview Lead Free Best Solution S400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot.   S400 Lead Free Wave Solder Machine

1 CLICK SMT TECHNOLOGY CO., Limited

Conformal Coating over No Clean Flux Residues

Technical Library | 2015-03-04 10:56:26.0

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues.

AIM Solder

2003 - Semi-automatic Stencil & Pallet Cleaner

2003 - Semi-automatic Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe

Smart Sonic Stencil Cleaning Systems

Plasma Fluxing Process: The Alternative to Conventional Fluxes

Industry News | 2020-03-22 11:52:51.0

Flux manufacturers have already reported a remarkable shortage of stocks for alcohol-based fluxes used in electronics manufacturing. Interrupted supply chains and an increasing demand for alcohol as a basis for disinfectants has resulted in massive price increases.

SEHO Systems GmbH

Lead Free Wave Solder Machine M400

Lead Free Wave Solder Machine M400

Videos

Quick Overview Lead Free Best Solution M400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. M400 Lead Free Wave Solder Machine

1 CLICK SMT TECHNOLOGY CO., Limited

Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components

Technical Library | 2017-07-20 15:18:15.0

As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.

Kester

NanoClear Coated Stencils

Technical Library | 2023-05-22 16:49:42.0

Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield  Insufficient solder  Bridging  Solder balls on surface of PCB  Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost)  USC fabric (use "cheap" fabric to reduce cost)  Lint creates more defects  Cleaning chemistries (use IPA to reduce cost)  IPA breaks down flux and can create more defects

ASM Assembly Systems (DEK)


flux issues searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Void Free Reflow Soldering

Software for SMT placement & AOI - Free Download.
Void Free Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Voidless Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Hot selling SMT spare parts and professional SMT machine solutions