Full Site - : flux not printed pads (Page 4 of 32)

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Cobar Solder Products to Exhibit XF3+ and 396-DRX at SMTAI 2009

Industry News | 2009-09-18 09:44:06.0

September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

Finetech

Kyzen's Debbie Carboni Selected to Present at SMTA West Pennsylvania Chapter Meeting

Industry News | 2010-06-23 12:37:04.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Debbie Carboni, Mid-Atlantic Territory Manager, will present a paper titled “Cause, Effects and Solutions for White Residue Formation” at the upcoming SMTA West Pennsylvania Chapter meeting. The presentation is scheduled to take place on Friday, July 23, 2010 at Aerotech’s headquarters in Pittsburgh, PA.

KYZEN Corporation

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Industry News | 2009-11-02 21:59:00.0

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

FCT ASSEMBLY, INC.

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi.

Industry News | 2014-08-05 17:29:07.0

Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation


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