Industry News | 2013-04-08 19:29:43.0
AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-09-21 12:22:09.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
The MBT 350, from PACE, is the standard that all other rework and repair systems are measured by. The system features PACE's exclusive IntelliHeat technology and can be used with 10 different handpieces. The MBT 350 has three handpiece channels tha
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2007-05-02 12:18:23.0
Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.
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Parts & Supplies | Pick and Place/Feeders
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Industry News | 2021-08-28 04:15:29.0
Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Industry News | 2010-03-22 13:14:36.0
GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.
Industry News | 2010-03-24 12:57:09.0
GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
