Full Site - : flux reballing (Page 5 of 11)

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Tue Mar 05 03:58:10 EST 2019 | pcformax

Hello guys, In our company we use CS-FLUX for reballing purposes in the last two years and we have no complain about the product.if you want to see details about the product there is a very helpful tutorial in youtube named 'ATI GPU removal with the

where to purchase solder spheres

Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin

I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg

Reball BGA process flow

Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian

I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug

High Volume BGA re-balling

Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen

Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:

BGA soldering & BGA ball formation

Electronics Forum | Mon Nov 17 13:26:05 EST 2008 | evtimov

With the gun you can do removal. Than clean the pads, put some flux, place new BGA(or reballed one) and put it in the reflow oven(if you have one). That's the cheap way you can go without buying an equipment. The other way is to buy machine for BGA

Repairing balls on BGA's

Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc

Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with

LGA component rework process on SRT machine

Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs

For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th

BGA Reballing

Electronics Forum | Tue Jun 13 23:08:32 EDT 2006 | mrduckmann2000

WINSLOW IS NOT THE BEST CHOICE, WE HAVE TRIED SEVERAL DIFFERNET STYLES OF BGA'S WITH NO LUCK. WINSLOW HAS EVEN HAD TROUBLE RE-BALLING OUR BGA'S. THEY SUGGEST LONG BAKE TIMES, DIFFERENT FLUXES...ETC NOTHING HAS WORKED PERFECTLY. THE PREFORMS ARE B

BGA rework using Tacky Flux

Electronics Forum | Sat Jan 14 08:13:14 EST 2006 | gipos Mike

We are doing a lot of CSP-BGA rework with tacky flux from Senju Metal.Their flux is very good.We are buying directly from Japan 529D flux. We have reworked BGA processor plastic sockets of Fujitsu Laptops. What kind of flux you are using? Not all of

Re: BGA REBALL

Electronics Forum | Tue Jun 27 11:39:16 EDT 2000 | Chris May

Leon, Have you tried a piece of glass, deposit some flux onto glass, place the BGA in the glass to flux it, replace BGA and reflow using existing solder deposition ?? Regards, Chris


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