Electronics Forum | Tue Aug 02 21:37:21 EDT 2005 | davef
Are we talking: * BGA that you've reballed and want to clean prior to attachment to a circuit board? * BGA that you've attached to a circuit board after correcting something or other? ... and we're talking a water soluble flux or what?
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Fri Aug 09 11:58:52 EDT 2002 | sam_b
Just started doing BGA rework. After the removal of the "old" component and after site cleaning/component reballing I am ready to install the component on the PCB. It is recommended to apply flux or paste to the board/component. I would appreciate m
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes
Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul
Electronics Forum | Sat May 17 02:13:43 EDT 2003 | Hon Choi
Thanks all. We are using no clean, so the boards are not washed. That would eliminate the trapped water issue. We would check the PCB after dismounting the BGA, and the short would not be found. When we place another BGA on the board, the board w
Electronics Forum | Thu Jul 07 17:59:58 EDT 2005 | russ
I have found that if you place it "upside down" with the paper on the bottom they work very well also. The paper has a tendency to warp during heating which causes the no connects. by adding flux to the preform you are essentially sticking the pref
Electronics Forum | Wed Feb 14 16:23:49 EST 2018 | cbart
do you mean you are seeing deviation in ball size prior to placement? if so i don't know of any spec that would cover this. however provided your ball is within 75% of the size of eachother and you are applying solder paste to the pads and not just t
Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory
Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's
