Electronics Forum | Wed Feb 14 16:23:49 EST 2018 | cbart
do you mean you are seeing deviation in ball size prior to placement? if so i don't know of any spec that would cover this. however provided your ball is within 75% of the size of eachother and you are applying solder paste to the pads and not just t
Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory
Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Tue Mar 22 17:08:01 EST 2005 | finepitch
We might need to open up the term "mass production" here, but I will give it a try anyway. I've seen semiconductor packaging companies in the far east where they pick up balls with a vacuum head, consisting of holes matching the pattern of the BGA p
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno
We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think
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