Full Site - : flux reballing (Page 8 of 11)

To use a mini stencil, or not to use a mini stencil.

Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto

We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection

Can anyone say NOT to use my reflow profile???

Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com

Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w

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