Full Site - : flux residue on i/o connector pins (Page 1 of 5)

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

Koh Young Highlighting its Award-winning Inspection Solutions at IPC APEX EXPO on April 09-11, 2024, in Anaheim, CA

Industry News | 2024-02-26 14:04:06.0

Koh Young invites electronics manufacturers to booth 2112 for live demonstrations of our award-winning inspection solutions. At the show, you can discover the future of inspection technology as Koh Young highlights innovative machines and smart factory software offerings, unveils new solutions to handle your toughest challenges and releases new software enhancements to make your life easier. We look forward to welcoming you to our booth at IPC APEX Expo in Anaheim, California 09-11 April 2024.

Koh Young America, Inc.

Koh Young to Showcase Award-winning Inspection and Smart Factory Solutions at SMTconnect on May 10-12, 2022, in Nuremberg, Germany

Industry News | 2022-04-28 14:30:28.0

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:

Koh Young America, Inc.

Koh Young Showing PCBA and Semiconductor Inspection Innovations at Productronica on November 14-17, 2023 at Messe München

Industry News | 2023-10-31 18:47:22.0

Koh Young will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.

Koh Young America, Inc.

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Industry News | 2017-11-24 20:19:27.0

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131

Shenmao Technology Inc.

Koh Young is highlighting its Award-winning True3D Inspection Solutions at IPC APEX EXPO on January 24-26, 2023, in San Diego, CA

Industry News | 2023-01-04 18:57:04.0

Atlanta, Georgia – Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.

Koh Young America, Inc.

Koh Young highlighting its Award-winning True 3D Inspection Solutions at IPC APEX Expo on January 25-27, 2022 in San Diego, CA

Industry News | 2022-01-05 09:15:19.0

Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California. After a lengthy lock-down, Koh Young will embrace the comprehensive safety and hygiene protocols in place to ensure a safe environment for attendees, so that the industry can meet face-to-face. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1717) and the Factory of the Future Pavilion (1701). The following is just a glimpse into what Koh Young will have in store for our visitors.

Koh Young America, Inc.

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Industry News | 2018-01-18 04:01:33.0

Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.

Balver Zinn

Press-fit Technology

Industry News | 2019-11-05 22:23:45.0

The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.

Headpcb

The Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Nuremberg 2015

Industry News | 2015-04-21 16:57:06.0

The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.

Balver Zinn


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Manufacturer

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Phone: (770) 538-0411

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