New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Electronics Forum | Thu Apr 05 07:15:55 EDT 2001 | Jerry
Same query: Do we really need to clean the board with when using RMA ? I've been told that aqeous is not needed to clean the board, what cleaner is suitable and how?
Electronics Forum | Tue Aug 26 15:51:42 EDT 2008 | kpm135
Did you check to see if the manufacturer's recommended reflow profile varied significantly for the new flux?
Industry News | 2011-04-22 21:54:12.0
The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Placing heads ("auto-tools") are exchanged automatically during production：The XPF is the world's first machine to feature dynamic head exchange.The machine can switch between a high-speed placing head and a multi-purpose hea
Parts & Supplies | Pick and Place/Feeders
Brand: FUJI Name: High Speed Multi Purpose Mounter Number Of Nozzles: 12pcs Supported Parts: 0402(1005) Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Weight: 1860KG High-speed Multi-Purpose Mounter XPF
Technical Library | 2022-02-16 15:34:32.0
Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11739055-multi-purpose-mounter-surface-mount-placement-machine-xpf-l-w-original-fuji.html
) Machine weight Machine body XPF-L: 1,500 kg / XPF-W: 1,860 kg MFU-40: Approx. 240 kg (with W8 feeders loaded) BTU-AII: Approx. 120 kg, BTU-B: Approx. 15 kg, MTU-AII: Approx. 615 kg (with trays/feeders loaded
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