Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Industry News | 2008-03-25 20:19:56.0
NORTH BILLERICA, Mass. � Mar. 25, 2008 � BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announced today that it will feature the Pyramax 100N and a new Pyramax product to be announced at the APEX show in booth #640, at the Mandalay Bay Resort and Convention Center, Las Vegas, April 1-3, 2008.
Industry News | 2008-04-07 21:59:44.0
NORTH BILLERICA, Mass., March 27, 2008�BTU International, a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will showcase the Pyramax 100N in Kasion Automation�s booth 1D05-A at the upcoming NEPCON China 2008 exhibition and conference, scheduled to take place April 8-11, 2008 in Shanghai, China.
Industry News | 2008-04-09 14:55:41.0
Pyramax 100 reflow oven receives two SMT China VISION Awards.
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2009-04-21 12:38:53.0
Since DEK introduced its ProFlow� enclosed print head system over a decade ago, it has been recognized industry-wide for its ability to advance materials deposition applications around the world. Today, DEK has extended the capabilities and process window of its pioneering technology even further with the launch of its highly anticipated ProFlow Evolution.
Industry News | 2011-03-08 13:40:11.0
Panasonic Factory Solutions Company of America introduces the NPM-W (Next Production Modular Wide) -- a new platform for processing PCBs up to 750 x 550mm in size, placing components up to 120 x 90mm, and accommodating up to 120 unique inputs per module.
Industry News | 2011-07-13 15:41:41.0
SEHO Systems GmbH announces that its recent seminars in the United States were a success.
Industry News | 2012-09-11 08:14:16.0
Kyzen has partnered with Nortec AMI, a leading provider of total ID solutions, to successfully complete a comprehensive label compatibility test series.
