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New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

wave soldering E-FLOW lead-free

wave soldering E-FLOW lead-free

New Equipment | Wave Soldering

     This machine use hot air and infrared mix heating system which can increase the speed and the uniformity of heating. It has lofs of advantage such as flux saving, quick response, easy coding and easy operation. Use a nitrogen devi

Shenzhen Sunzon Technology Co.,Ltd.

Sono-Tek to Debut EZ-Flux Ultrasonic Reciprocating Spray Fluxing System at APEX 2008

Industry News | 2008-02-28 14:15:01.0

Milton, NY � February 2008 � Sono-Tek Corporation, the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems, announces that it will introduce EZ-Flux Ultrasonic Reciprocating Spray Fluxing System in booth 263 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

SONO-TEK CORPORATION

Sono-Tek to Debut EZ-Flux Ultrasonic Reciprocating Spray Fluxing System at APEX 2008

Industry News | 2008-03-14 18:56:09.0

Milton, NY � March 2008 � Sono-Tek Corporation, the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems, announces that it will introduce EZ-Flux Ultrasonic Reciprocating Spray Fluxing System in booth 263 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

SONO-TEK CORPORATION

OAJ Cored Wire

OAJ Cored Wire

New Equipment | Solder Materials

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting

AIM Solder

Sono-Tek to Feature SonoFlux EZ at Componex/Nepcon India 2009

Industry News | 2009-01-21 19:51:27.0

Milton, NY � January 2009 � Sono-Tek Corporation, the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems, announces that it will feature the SonoFlux EZ Ultrasonic Reciprocating Spray Fluxing System in booth #406 at the upcoming Componex/Nepcon India 2009, scheduled to take place February 24-26, 2009 in New Delhi.

SONO-TEK CORPORATION

WS482 Cored Wire

WS482 Cored Wire

New Equipment | Solder Materials

WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys. WS4

AIM Solder

Heller 1912 EXL Reflow Oven

Heller 1912 EXL Reflow Oven

Used SMT Equipment | Soldering - Reflow

Usage : 32k hours Transfer Direction: Left to Right Configuration 12 Heated Zone (top & bottom) 3 cooling zones Edge / Mesh conveyance SMEMA Nitrogen ready Flux separation system Auto chain oiler Onboard profil

Capital Equipment Exchange

Connexion International Co., Ltd.

Industry Directory | Manufacturer

Nitrogen Hot Air Circulation Reflow, Screen Printer, Wave Soldering, Double Unloader, Inverter Machine, 90° PCB Transfer Buffer Loader & Unloader


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