BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.
High quality, flexibility and reliabilty offered in a complete all-in-one package is what you get with the inline iCube Selective Soldering System. Feature rich and designed for high-end production, the iCube is the answer to all of your soldering ne
Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
Industry News | 2014-09-10 18:10:57.0
Indium Corporation announces the release of a revolutionary new product called EZ-Pour™ Gallium Trichloride (GaCl3).
Industry News | 2015-11-16 18:19:51.0
Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.
Industry News | 2015-11-18 18:52:07.0
Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
Industry News | 2012-10-09 16:18:14.0
The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.
Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow
