Full Site - : flux transfer (Page 9 of 32)

Indium Corporation Announces New EZ-Pour™ Gallium Trichloride.

Industry News | 2014-09-10 18:10:57.0

Indium Corporation announces the release of a revolutionary new product called EZ-Pour™ Gallium Trichloride (GaCl3).

Indium Corporation

Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes

Industry News | 2015-11-16 18:19:51.0

Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.

Indium Corporation

Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes

Industry News | 2015-11-18 18:52:07.0

Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.

Indium Corporation

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

Manncorp Brings High-Precision, Selective Soldering and Fluxing to the Bench-Top with the New ULTIMA Series

Industry News | 2012-10-09 16:18:14.0

The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.

Manncorp

SEHO GoReflow - Compact Reflow Oven

SEHO GoReflow - Compact Reflow Oven

New Equipment | Reflow

Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow

SEHO Systems GmbH

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processed on site in this safe, mobile, user-friendly system.

As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processed on site in this safe, mobile, user-friendly system.

Videos

The EVS Solder Recovery system recylces solder form dross using no chemicals or additives, on site, in an efficient, easy process. As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processe

EVS International

Hybrid Rework System Ersa HR 600/2

Hybrid Rework System Ersa HR 600/2

Videos

Hybrid Rework System - automatic desoldering, placement and soldering of SMT components. New definition of assembly unit repair - automatic, flexible and process reliable! Find our products ? http://www.kurtzersa.com/electronics-production-equipment

kurtz ersa Corporation

Indium Corporation Technology Experts Presenting at APEX

Industry News | 2010-04-09 21:17:21.0

Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.

Indium Corporation


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