Full Site - : flying probe ict difference (Page 31 of 39)

AOI vs. electrical test

Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc

In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is

Lead Free and ICT

Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika

Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t

Simulate the cycle time for ICT, FPT tester

Electronics Forum | Thu Mar 19 02:35:48 EDT 2020 | franknguyen

Hi, I got a new project, and need to provide customer the ICT (In-Circuit-Testing), FPT (Flying-Probe-Testing) process quotation. The new PCBA contains analog components, digital components, and some BGAs that can support Boundary Scan. Does anyone

Inner short

Electronics Forum | Thu Aug 30 16:27:05 EDT 2018 | emeto

You should request 100% Flying probe coverage - will cost you extra. If you have bigger quantities you could consider ICT fixture.

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Mon Dec 12 13:09:46 EST 2005 | Kris

do you intend to use Immersion tin as a PCB surface finish ? Then Whisker concern is as below if you do not past your test pads, the pads will be stressed when probed on a ICT or a flying probe tester. This is a POTENTIAL for whiskers There is a lo

Spare parts for SMT ICT machine

Electronics Forum | Wed Nov 15 11:42:37 EST 2006 | AndyGAC

I work for an electronics manufacturing plant in North Carolina. We have a Teradyne Javelin 1004 flying probe machine, but we are looking for spare parts for it at a cheaper rate than our initial quote. Do any of you happen to know of any sites on

Probe Mark during ICT

Electronics Forum | Tue Jun 05 02:22:07 EDT 2012 | vileo72

Dear Dave/pr/Reese, Thank you so much for the information and this will certainly help me to align on the query .Would like to know further :During Flying probe testing the vias are also observed that they have pin mark on the annular ring due to the

Re: ICT Fixtures No-Clean Flux

Electronics Forum | Thu Mar 23 20:31:45 EST 2000 | davef

Hey Cartman: Recently, I was over at a plant that does ICT on RMA fluxed boards and asked them about flux residue on test probes. The test machine operators: * Think flux residues are a pain in the gluteus maximus. * Change probes (from a collectio

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl

Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer

Relying on AOI for sensor boards - EOL for functional test

Electronics Forum | Tue Jul 31 04:45:42 EDT 2018 | robl

Depends on what sort of outfit you are working for, and what you are building. A lot of CEMs are doing Flying Probe or ICT on the boards ahead of investing time building into units or adding parts that prevent access to rework. We have a combination


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