MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2003-02-12 09:25:17.0
35% stake in Topgrow Technologies
