Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Used SMT Equipment | Chipshooters / Chip Mounters
NXT IIIC has the same features of the NXT III but in a smaller footprint. This allows you to maximize production in a restricted floorspace environment.Fuji Scalable Placement Platform. The best floorspace productivity in the industry. One NXT IIIc m
Used SMT Equipment | Coating and Encapsulation
Work Area 1 Valve / Tool: 521 mm x 485 mm x 100 mm (20.51 in x 19.09 in x 3.94 in) XYZ Repeatability ±25 microns (±0.001 in) Resolution 5 microns (0.0002 in) Maximum Acceleration .6 g Footprint 847 mm x 1136.9 mm x 1606 mm (33.35 in x
Technical Library | 2019-06-06 13:40:47.0
Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
The CameraLink industrial digital cameras offer high performance in a very small footprint. The advanced 25M color CMOS sensor provides the absolute best image quality at an incredible frame rate of 30 fps! The camera Link Interface ensures High spee
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Global OEM manufacturer of selective wave soldering machines. With a world-wide install base in over 65 countries, we are a global leader in the selective soldering space. Highly customized solutions available in all industries.
The CameraLink industrial digital cameras offer high performance in a very small footprint. The advanced 25M color CMOS sensor provides the absolute best image quality at an incredible frame rate of 30 fps! The camera Link Interface ensures High spee
Used SMT Equipment | Chipshooters / Chip Mounters
Hanwha SM471 SMT Plus Pick And Place Machine Hanwha SM471 SMT Plus Pick And Place Machine Features: Fast Electric Feeders which automatically adjust their pocket positions for ultimate synchronised picking Front and back operation as standard Larg
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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