Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey
| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
