Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Electronics Forum | Fri Oct 29 16:28:19 EDT 2004 | hyabro
Specnor Canada has developped a very well performed equipment for lead free application.It calls Tornado series and they offer in five, seven, ten zones. These ovens are made of stainless steel parts and with a very competitif price. You can reach th
Electronics Forum | Mon Sep 17 19:06:55 EDT 2007 | davef
We have TR-460A. We do not use it very often, because of the level of experience of our troop. It is useful for companies looking to develop, structure, and organize their wave soldering process troubleshooting skills. The information in TR-460A is n
Used SMT Equipment | Board Cleaners
BAY-CHEM is hi-tech Speciality Chemical Formulations Manufacturing Unit established in the year 1996.This is being driven by its own Research & Development wing
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
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Parts & Supplies | Pick and Place/Feeders
JUKI 538# Nozzle for Juki Nozzle We specialized in smt spare parts for 16 years, the quality fulfills the standards you need. If you dont find the spare parts for your Juki machines, do not hesitate to contact us, we are in continuous developing.
Parts & Supplies | Pick and Place/Feeders
All the best Email:wendy@leadersmt.com Whatsapp: +86 13148795469
Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
https://www.ascen.ltd/component_tape_feeder/ Robotic component axial tape feeder for robot that use to cuts and bends taped axial components,and then holds the component so that the robot can pick them up online or link to the SMT insertion machine f
https://www.ascen.ltd/component_tape_feeder/ Robotic component axial tape feeder for robot that use to cuts and bends taped axial components,and then holds the component so that the robot can pick them up online or link to the SMT insertion machine f
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Individual(s) will be responsible for the development and growth of electronics assembly and manufacturing business. The sales representative will cultivate new relationships and develop/enhance current relationships to increase the company's positi
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www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
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professional in manufacturering pcba with high quality
Career Center | Shenzhen, China | Sales/Marketing
professional in manufacturering pcba with high quality
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