Industry News | 2011-02-26 15:31:07.0
Kyzen will showcase products for every process at the upcoming VIRTUAL PCB virtual tradeshow and conference, scheduled to take place March 8-9, 2011.
Industry News | 2011-03-14 18:34:34.0
Kyzen will showcase products for every process at the upcoming SMTA Intermountain Chapter Expo & Tech Forum, scheduled to take place Tuesday, March 22, 2011 at Boise State University in Boise, ID.
Industry News | 2011-04-07 20:47:47.0
Kyzen will showcase products for every process at the upcoming SMTA Toronto Expo & Tech Forum. Kyzen’s extensive line of cleaning technologies has been developed according to the increasing demand for advanced cleaning chemistries.
Industry News | 2011-05-10 19:19:18.0
Kyzen will showcase products for every process at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2011-08-18 21:09:36.0
Kyzen will showcase products for every process at the upcoming Long Island SMTA Expo and Technical Forum.
Industry News | 2011-10-07 23:00:12.0
Kyzen will showcase products for every process at the upcoming SMTA Wisconsin/Great Lakes Expo & Tech Forum
Industry News | 2011-11-03 21:32:00.0
Kyzen will showcase products for every process at the upcoming SMTA Austin Expo & Tech Forum
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2017-03-13 10:58:51.0
Kester is proud to announce the launch of WP601-ZH, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.
