Technical Library | 2018-10-31 20:35:49.0
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
Industry Directory | Manufacturer
Inventec, one of Europe's leading Performance Chemicals companies, is the high-tech industries business of the Dehon Group
Industry Directory | Manufacturer
Manufacturer of high performance, alternative cleaning agents. Petroferm Provides products to most cleaning process technologies; aqueous, co-solvent, hydrocarbon/solvent, semi-aqueous, and vapor degreasing.
Industry Directory | Manufacturer
Intrinsiq Materials manufactures a variety of electronic ink, including screen-printable, and inkjetable copper ink, a silicon ink jet, and a nickel ink jet.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a MacDermid Performance Solutions Business, and a leader in providing global semiconductor packaging manufacturers with innovative, high performance materials, is seeking a Formulation Chemist for their Suwanee, GA Research
World’s first water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools ATRON® DC is engineered specifically for maximum decoating power while prioritizing the highest level of operator safety. It is
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
KEACO offers both heat activated and PSA cover tapes. This includes formulations designed for specific carrier tape materials such as Polycarbonate and Polystyrene. All sizes available.
