Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Various process formulations for Electronic industry mainly for the fabrication of Printed Circuit Boards. Speciality Anticorrosives offered in the name of"COROBAN" Range Of Acid Corrosion Inhibitors
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
Industry Directory | Manufacturer
A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.
Used SMT Equipment | In-Circuit Testers
Keithley 4200-SCS Semiconductor Characterization System The Keithley Interactive Test Environment (KITE) is designed to let users understand device behavior quickly. When running a test sequence, users can view results and plots for completed t
Used SMT Equipment | In-Circuit Testers
Keithley 4200-SCS Semiconductor Characterization System The Keithley Interactive Test Environment (KITE) is designed to let users understand device behavior quickly. When running a test sequence, users can view results and plots for completed t
Industry Directory | Manufacturer
UV & Thermal Cure Epoxies for Adhesives, Coatings & Sealants
Industry Directory | Manufacturer
Shenwei is a leading manufacturer of high-quality and heavy-duty v-belts for the agricultural and industrial drives. We use the certified raw materials and components, unique process formulation, advanced processing technology and
Technical Library | 2018-10-31 20:35:49.0
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
