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Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High Reliability Applications

Technical Library | 2018-09-05 21:41:30.0

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux.

Koki Company LTD

WEECONS® Ceramic Capacitors

WEECONS® Ceramic Capacitors

New Equipment | Components

WEECONS® Ceramic Capacitors have long been the standard of the industry, and offer the broadest selection of available ceramic formulations and package sizes. With a capacitance range of 1 pF to .082 mF, WEECON® capacitors offer a variety of TC mater

TUSONIX, Inc.

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Technical Library | 2008-07-10 12:52:18.0

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing.

Cookson Electronics

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Technical Library | 2010-12-22 13:59:14.0

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.

i3 Electronics

Potting And Encapsulating – Avoiding Voids

Technical Library | 2021-08-11 00:52:35.0

Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue.

Intertronics

Proton 71

New Equipment |  

is a solvent-based cleaning medium, free of CFC, halogens and water, specially designed to remove acrylic and acrylurethane lacquers from PC boards and screens. Surfactant-free formulation of PROTON 71 eliminates the formation of white residues on c

DCT Cleaning

Scientist - Chemistry

Career Center | South Plainfield, New Jersey USA | Research and Development

Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek

Alpha Assembly Solutions

KYZEN Corporation

Industry Directory | Manufacturer

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Multicore Solders

Industry Directory | Distributor

Manufacturer of soldering materials, paste solder

Intelligent Dispensing Systems

Industry Directory | Manufacturer

Total solutions for adhesive, solder and UV cure applications.


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