Industry News | 2010-09-28 12:18:33.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a comprehensive video display interfaces suite for High-Definition Multimedia Interface (HDMI 1.3a), Digital Visual Interface (DVI), and 7:1 LVDS Interface. All of these display interfaces are available as free Reference Designs for the award winning, mid-range LatticeECP3™, while selected free Reference Designs can also be ported to the LatticeECP2M™ and LatticeXP2™ FPGA families.
Industry News | 2011-02-07 15:59:43.0
Lattice Semiconductor Corporation today announced the immediate availability of five new comprehensive Intellectual Property (IP) Suites to accelerate the design of electronic systems in a variety of industries using the award winning LatticeECP3™ FPGA family.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
INSIL corporation provides various design services in the domains of VLSI. We accept outsourcing design services. some of the services include PCB design, board design, high speed design, networking board design, Reference board design. We have exper
INSIL corporation provides various design services in the domains of VLSI. We accept outsourcing design services. some of the services include PCB design, board design, high speed design, networking board design, Reference board design. We have exper
Industry News | 2001-12-14 15:08:35.0
Avail. for ordering at Dynamic Engineering
Industry News | 2010-10-30 02:18:28.0
Lattice Semiconductor Corporation announced its new PAC-Designer® design software version 6.0, which enables analog and board designers to integrate a circuit board’s power management and digital board management functions into the newly announced Platform Manager™ device family.
Product design engineers from inception to manufacture, covering digital and anlogue electronic, mechanical, embedded internet, PIC approved, FPGA, mecatronic, medical, intrusmentation and control industries
Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.
Embedded System Tools including Starter Kits, Emulators, In System Programmers (ISP), Gang and Universal Programmers, C Compilers, Education and Training Tools and more. Target microcontrollers are AVR, PICmicro, COP8, ST7, 8051, MC11 plus memory.
