Industry News | 2013-03-20 10:54:36.0
Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2003-05-27 08:20:51.0
Extends from high-level FPGA design through Printed Circuit Board (PCB) design
Industry News | 2018-09-30 07:23:45.0
PVA is pleased to announce that the company is hosting an Optical Bonding Seminar in Shanghai on Thursday, Oct. 11, 2018 at the Marriott Shanghai Hongqiao.
Industry News | 2019-04-16 19:56:44.0
PVA will exhibit at Display Week 2019, scheduled to take place May 14-16, 2019 at the San Jose Convention Center in CA. PVA’s expert in optical bonding, Alex Giordano, will discuss the company’s optical bonding capabilities.
Industry News | 2009-12-02 21:17:33.0
Altium releases smart prototyping peripheral board for its NanoBoard FPGA-based development platforms.
Industry News | 2017-06-20 20:10:59.0
Specialty Coating Systems (SCS) is pleased to announce that it will participate in a Machine Design-sponsored webinar on Thursday, July 27, 2017 at 2 p.m. EDT. The webinar, entitled “Using Conformal Coatings to Mitigate System Failures,” will be presented by SCS’ Tim Seifert, Military & Avionics Market Manager, and Rakesh Kumar, Ph.D., Vice President of Technology. The webinar is now open for registration at: scswebinars.com.
Industry News | 2014-04-01 20:16:29.0
ADLINKs presentation topic this year - Improving Signal Fidelity with FPGA Signal Averaging on PXI Module.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2013-04-02 11:24:03.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the promotion of Elaine Yeomans to Marketing Communications Manager.
